This article explores the widespread use of PFAS in electronics manufacturing – particularly in semiconductor fabrication – detailing contamination pathways, regulatory pressure, detection methods and emerging strategies for phase-out and life cycle management.
The role of PFAS (per- and polyfluoroalkyl substances) in the electronics sector is extensive and increasingly scrutinised. Their unique chemical properties, such as high thermal stability, chemical inertness and hydrophobicity, make them essential in various precision-driven processes.
However, their persistence in the environment, bioaccumulative behaviour and growing regulatory attention are forcing the electronics manufacturing industry to trace, quantify and reduce their presence across the supply chain.
Where PFAS are used in electronics manufacturing
In microelectronics, PFAS are used across multiple process stages, from wafer fabrication to final device packaging. One of the most critical areas is PFAS is semiconductor manufacturing, where perfluorinated surfactants are formulated into photoresists and antireflective coatings. These materials enable precise patterning at sub-10 nm geometries.
In the etch phase, fluorinated process gases are employed in plasma etch reactors. Plasma-based etching provides more precise control during this phase. These gases facilitate the etching of silicon, silicon dioxide and low-k dielectrics with high selectivity. Many of these gases break down into PFAS-related byproducts during plasma reactions, which abatement systems may not fully capture.
Other PFAS compounds are found in:
- Degreasers and solvents for wafer cleaning
- Coolants for ion implanters and test equipment
- Dielectric materials for high-frequency and 5G circuitry
- Wire coatings and PCB laminates, typically using PTFE or fluorinated ethylene propylene (FEP)
Due to their low dielectric constants, high breakdown voltages and chemical resistance, PFAS’s functional role is irreplaceable in many high-spec environments. This makes their tracking even more vital as phase-outs and substitutions loom.
PFAS contamination pathways
PFAS contamination originates from direct usage and secondary reactions. For instance, plasma etching generates fluorinated byproducts that are volatile and can deposit onto reactor walls, gas lines and abatement components. Over time, these residues accumulate, leading to contamination during maintenance, fab tool swaps or even HVAC system disruptions.
Key contamination vectors include:
- Airborne particulates from plasma chambers
- Spent process gases exhausted without adequate scrubbers
- Liquid waste streams, including rinse solutions and developer baths
- Tool surfaces exposed to repeated PFAS-laden processes
Nonpoint contamination also occurs. For example, even fluoropolymer seals and gaskets in wet benches and chemical delivery lines can reach low levels of PFAS into ultrapure water (UPW) systems. Once these compounds enter the closed-loop water recycling systems common in fabs, they’re difficult to remove, often requiring advanced oxidation processes, carbon filtration or ion-exchange resins.
Tracking and testing
Accurate detection of PFAS contamination in electronic environments requires a multi-method approach. Flame ionisation detection is insufficient for many low-volatility PFAS compounds. Instead, labs now rely on:
- Liquid Chromatography-Mass Spectrometry (LC-MS/MS) for identifying ultra-trace PFAS in water and solvents
- Combustion Ion Chromatography (CIC) for measuring total organic fluorine (TOF) in complex matrices
- Thermal Desorption-GC/MS for solid-phase materials such as wafers, resins and process chambers
Since many electronic manufacturers operate on multi-tiered supply chains, third-party inputs can compromise material traceability. Packaging foams, adhesives and transport materials can all be unexpected PFAS sources.
To address this, some industry leaders are requiring full fluorine disclosure from suppliers and are creating in-house PFAS inventories that track usage across chemicals, equipment and environmental outputs.
PFAS regulations and their impact
Regulatory pressure is intensifying. The proposed EU REACH restriction, submitted by five member states in 2023, could eliminate thousands of PFAS compounds within the next decade. These include short-chain PFAS, which are often assumed to be safer despite emerging evidence of similar toxicity and persistence.
PFAS regulations in the United States are increasingly enforced at federal and state levels. The U.S. EPA has added more than 100 PFAS to its Toxic Release Inventory (TRI). The organisation is also finalising rules under the Safe Drinking Water Act that will require reporting and mitigation at water systems when levels exceed four ppt for PFOA and PFOS.
Several states, including Washington and New York, have independently banned the use of certain PFAS in electronics packaging and flame retardants. Failure to comply with these evolving regulations risks costly shutdowns, fires and exclusion from global markets increasingly governed by sustainability metrics.
Strategic shifts in PFAS management across electronics manufacturing
The electronics industry is responding to the growing risks and scrutiny surrounding PFAS by making targeted changes across materials, equipment and process design. One major focus is substitution, such as estolide oils and synthetic waxes.
Manufacturers are actively testing the fluorine-free photoresists, surfactants and etchants that can replicate the performance of PFAS-based materials without the same environmental concerns. Manufacturers are exploring these alternatives in wet etch, cleaning and lithography steps where PFAS are commonly used to control surface tension or promote uniform film formation.
Design teams are also modifying process flows to minimise thermal decomposition of PFAS-containing materials. By reducing exposure to high-energy plasma or heat-intensive annealing steps, fabs can reduce the formation of persistent byproducts. Equipment suppliers are closely collaborating to introduce new deposition and etch systems with better containment and exhaust treatment capabilities to capture or destroy PFAS-laden effluents before they enter the broader waste stream.
In tandem with material and equipment changes, companies are investing in broader contamination control and traceability infrastructure. This includes point-of-use gas abatement systems with enhanced fluorine capture rates and sealed chemical delivery loops. There’s also a push for monitoring and treating wastewater, which isn’t currently legally required. Some fabs implement end-to-end PFAS traceability protocols using digital tools that integrate supplier disclosures and emissions monitoring into a unique compliance framework.
Even at organisational level, there’s a shift underway. Companies embed PFAS accountability into ESG goals, R&D roadmaps and supplier scorecards. As PFAS regulations evolve — especially in the US, EU and Asia — compliance is a critical element of long-term operational resilience and brand trust.
PFAS challenges in equipment recycling and decommissioning
As fabs upgrade to newer process nodes and retire ageing equipment, a new challenge has emerged — managing PFAS residues embedded in decommissioned tools. Vacuum pumps, exhaust lines and process chambers — especially those used in dry etch and CVD — often contain residual fluorinated compounds that persist even after standard decontamination procedures. These residues complicate resale, refurbishment and disposal, particularly when equipment crosses international borders subject to differing PFAS regulations.
In some areas, improperly handled PFAS-bearing components may be classified as hazardous waste, requiring specialised transport and treatment. Moreover, cleaning solvents used during decommissioning can mobilise PFAS into wastewater if not captured appropriately.
As a result, equipment OEMs and fabs are beginning to develop PFAS-specific decontamination protocols and calling for shared end-of-life management standards. Addressing these overlooked life cycle stages is critical for achieving true PFAS accountability beyond the clean room and into the secondary equipment market.
Moving from passive management to active elimination
The electronics industry can no longer afford to treat PFAS as a necessary evil. Their persistent use across gases, resins, coatings and adhesives has created a diffuse but measurable risk profile — impacting environmental compliance, product quality and worker safety.
The path forward requires technical precision, deliberate substitution and systems-level transparency.
